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Double Side |
Multi Layer |
Special PCB |
Solder & Assemble |
Item | Capabilities | |||
Number of Layers | Single /Double Sided - 12 Layers | |||
Major Material | FR-4, CEM-3, Hologen free, High
Tg (Other material as request) |
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Min. Board Thickness | Double Side | 0.2mm (7.8mil) | ||
4 Layers | 0.4mm (16 mil) | |||
6 Layers | 0.6mm (24 mil) | |||
8 Layers | 1.0mm (40 mil) | |||
10 Layers | 1.2mm (48 mil) | |||
12 Layers | 1.5mm (59 mil) | |||
Max. Board Thickness | 3.2mm (125 mil) | |||
Surface Finishing | -Flash Gold Plating | |||
-Immersion Gold (Max. 0.5¦Ìm) | ||||
-Thick Gold Plating (Max. 1.5¦Ìm) | ||||
-HASL (Tin / Lead) | ||||
-Entek Coating (OSP) - Gold finger |
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-HASL - Lead Free | ||||
-Immersion Tin | ||||
Solder Mask | LPI (Wet Film), Thermal Cured Type | |||
Other Printing | Carbon Print, Peelable Solder Mask | |||
Solder Mask Plugged Hole | ||||
Copper Thickness (Finishing) | 1/2 oz (18 ¦Ìm) - 4 oz (140 ¦Ìm) | |||
Min. Hole Size | 0.25mm (10 mil) | |||
Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |||
Hole Size Tolerance (PTH) | +/-0.076mm (3 mil) | |||
Min. Line Width and Spacing | 0.1mm (4 mil) | |||
Min. Solder Mask Clearance | 0.076mm (3mil) | |||
Min. Annular Ring | 0.076mm (3mil) | |||
Profile and V-Cut | V-Cut, Jump V-Cut, CNC V-Cut | |||
CNC-Routing, Stamping and Beveling | ||||
Special Process | Blind/Buried Via Hole | |||
If you have any special requirments,we can do for you! |
ZhongHaiKaiRui
PCB Co., Ltd.
Tel£º86-10-64975678
Email: zhkrpcbvip@126.com